Hard and brittle materials / composite materials wafer grinding machine 'R631DF'
Equipped with an automatic transport system! Capable of high-precision grinding of various difficult-to-machine materials wafers.
The "R631DF" is a super precision surface grinding machine designed for high-precision grinding. It features a built-in servo motor type air spindle. With a high rigidity (μm/300N) air static bearing, it offers a high damping effect. Additionally, it replaces the conventional lapping process with a grinding process, achieving high efficiency and full automation. 【Features】 ■ Vertical axis type ■ Compatible with various hard-to-machine materials and wafer grinding ■ Equipped with an automatic transport system ■ High-precision grinding of various hard-to-machine material wafers ■ Replaces the conventional lapping process with grinding, achieving high efficiency and full automation *For more details, please refer to the PDF document or feel free to contact us.
- Company：ジェイテクトマシンシステム 旧）光洋機械工業株式会社
- Price：Other
